Who said that only Samsung and Huawei know how to create foldable smartphones? Honor will soon join the bandwagon due to the upcoming Magic V2 model, a foldable device that will conquer the hearts of many.
The forthcoming Honor Magic V2 will be powered by the Snapdragon 8 Gen 2 chipset from Qualcomm. That alone can get you a strong reason to be willing to see the phone revealed in its full glory! That moment will come very soon, thankfully!
Honor Magic V2 launches on July 12
Notebookcheck has discovered that Honor plans to launch its next foldable device on July 12. Honor plans to commemorate the 10th anniversary of its X series with a new generation smartphone featuring impressive specifications, such as a Snapdragon 6 Gen 1 SoC and a 1.5K “eye-protecting curved screen. Leaks suggest the existence of the Honor X50-series as mid-range device with high-resolution cameras, ample RAM, as well as large batteries.
However, the real excitement surrounds the highly anticipated Magic V2 foldable phone, which is expected to set a new standard in such devices. With the Snapdragon 8 Gen 2 chipset powering the Magic V2, there’s no wonder how powerful the device will be. It could even beat the Samsung Galaxy Z Fold5.
Honor Magic V2 will also pack a main Foldable LTPO OLED display of 7.9 inches. This will clearly be a very powerful display for anyone who’s willing to use such a phone for gaming or photography, among other sophisticated tasks. The main 108MP camera of the Honor Magic V2 represents another strong reason to believe that Honor is not toying around.
Honor will celebrate the 10th anniversary of the X series in less than a week, on July 5, 2023. On the other hand, the Magic V2 phone will launch after a week.